High-frequency RF PCB assembly, high-speed SMT placement, 3D AOI and micro-BGA X-ray inspection in cleanroom suites.
Specialized in high-mix, high-complexity electronic assemblies, C24ME offers precision Surface Mount Technology (SMT) and through-hole manufacturing. We specialize in high-frequency RF substrates (Rogers, Taconic, Megtron), rigid-flex boards, and high-density interconnect (HDI) technologies under strict ISO 9001 and IPC-A-610 Class 3 workmanship criteria.
Automated design rule checking and high-accuracy laser-cut nanocoated solder paste stencils.
Pick-and-place lines handling 01005 passives, fine-pitch micro-BGAs, and specialized RF shields.
Precisely tuned thermal profiles ensuring void-free solder joints and controlled intermetallic layer formation.
Automated optical inspection combined with 3D X-ray verification for bottom-terminated components and BGAs.
Selective acrylic/silicone/parylene conformal coating and complete turn-key box build integration.
High-frequency 8-layer mixed dielectric PCBA operating up to 30 GHz with tight impedance tolerances.
Conformal-coated PCBA certified to automotive shock, vibration, and temperature extremes.
Cleanroom-assembled power regulation board designed for radiation tolerance in low-earth orbit.
Speak directly with an application engineer. We review technical drawings, pinouts, and volume requirements under mutual NDA within 24 business hours.