COMPREHENSIVE HARDWARE DISCIPLINES · CONCEPT TO FLIGHT

Advanced Engineering & Precision Manufacturing Services

From 3D electromagnetic modeling and rapid PCB prototyping to mil-spec cable harnesses and volume cleanroom production, C24ME provides vertically integrated electronic hardware capabilities for defense, aerospace, and advanced industries.

5 Core Domains

Vertically Integrated Capabilities

100% In-House

Design, Fabrication & Anechoic Testing

Class 3 Quality

IPC/WHMA-A-620 & AS9100 Rev D

10–14 Day Sprints

Rapid Engineering Prototyping
FULL-SPECTRUM CAPABILITIES

Our Specialized Service Lines

Click into any discipline below to view comprehensive technical specifications, methodologies, and related case studies.

01
INTERCONNECT SYSTEMS

Cable Harness Engineering & Manufacturing

Custom military and aerospace wire harness assemblies engineered for extreme environmental demands. We provide automated wire cutting, laser wire marking, multi-conductor braided shielding (up to 90 dB attenuation), low-pressure polyurethane overmolding, and 100% automated Cirris continuity and Hi-Pot dielectric testing.

IPC/WHMA-A-620 Class 3
Hi-Pot & Cirris Tested
Polyurethane Overmolding
Mil-Spec Interconnects

Key Capabilities:

  • High-flex robotics & avionics payload cabling
  • IP68 submersible & underwater potted harnesses
  • Severe vibration, shock & thermal cycling qualification
  • Automated 4-wire Kelvin micro-ohm testing
02
ELECTROMAGNETIC SYSTEMS

Antenna Design & Custom Manufacturing

High-performance RF, microwave, and millimeter-wave antenna architectures spanning 100 MHz to 60+ GHz. We specialize in electronically steerable phased array systems, conformal aerodynamic UAV radomes, helical satellite feeds, and microstrip patch arrays tested in our on-site multi-axis anechoic chamber.

100 MHz – 60 GHz Range
Phased Array Antennas
Anechoic Verification
HFSS & CST Modeling

Key Capabilities:

  • 3D spherical radiation pattern mapping
  • S-parameter and return loss vector analysis
  • Conformal aerodynamic radome integration
  • MIL-STD-810 thermal & shock environmental testing
03
FIELD & LAB DIAGNOSTICS

RF Testing and Field Survey

Turnkey radio frequency spectrum investigations, EMI/EMC compliance diagnostics, and calibrated field survey operations. Equipped with calibrated vector network analyzers, portable spectrum analyzers, and tracking generators, our senior RF engineers isolate interference and certify mission communications.

EMI / EMC Auditing
Interference Triangulation
Path Loss Modeling
NIST Traceable

Key Capabilities:

  • Airspace & radar spectrum clearing surveys
  • Industrial wireless mesh propagation audits
  • Passive intermodulation (PIM) measurements
  • Actionable engineering mitigation reports
04
CLEANROOM HARDWARE FABRICATION

Precision PCBA Manufacturing

High-mix, high-reliability surface mount technology (SMT) and through-hole assembly specializing in high-frequency RF substrates (Rogers, Taconic, Megtron). Operating under strict cleanroom controls, our facility features multi-zone nitrogen reflow ovens, 01005 component capability, and 3D automated optical & X-ray micro-BGA void inspection.

Rogers & Megtron RF Substrates
01005 High-Speed SMT
3D AOI & X-Ray Inspection
Nitrogen Reflow Soldering

Key Capabilities:

  • High-density interconnect (HDI) & rigid-flex boards
  • Mil-spec conformal coating (acrylic, silicone, parylene)
  • Full turn-key electronic box build & enclosure integration
  • IPC-A-610 Class 3 workmanship criteria
05
ARCHITECTURE & DFM

Engineering Architecture & Consulting

Bridging early-stage hardware concepts and flight-ready production reality. Our consulting practice provides high-speed signal integrity (SI) simulation, thermal modeling, regulatory pre-compliance audits (FCC, CE, MIL-STD-461), and comprehensive Design for Manufacturability (DFM) reviews that optimize bill-of-materials costs and eliminate fabrication risks.

Signal Integrity & Eye Diagrams
DFM & BOM Sourcing Audits
MIL-STD-461 Pre-Screening
Thermal Dissipation Modeling

Key Capabilities:

  • High-speed multi-gigabit backplane modeling
  • Vendor qualification & supply chain de-risking
  • Pre-compliance lab verification guarantees
  • Test fixture & automated test bench development
OUR PROVEN METHODOLOGY

5-Stage Engineering Lifecycle

Stage 01

Requirements & DFM

In-depth schematic review, pinouts, mechanical routing, and component sourcing feasibility.

Stage 02

3D Simulation

Electromagnetic, thermal, and vibrational modeling de-risking designs prior to physical fabrication.

Stage 03

Rapid Prototyping

Fast-turn cleanroom fabrication delivering functional test prototypes in as few as 10–14 days.

Stage 04

Environmental QA

100% Cirris continuity, Hi-Pot screening, 60 GHz anechoic testing, and thermal stress cycling.

Stage 05

Production Delivery

Scaled batch manufacturing delivered with Certificate of Conformance (CoC) and trace logs.

Ready to Scope Your Next Engineering Project?

Consult directly with a senior RF architect or wire harness engineer. We review technical drawings, pinout schematics, and BOM specifications under mutual NDA within 24 business hours.

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